Ose ari maviri SoC (System paChip) uye SiP (System muPackage) zviitiko zvakakosha mukuvandudzwa kwemaseketi emazuva ano akabatanidzwa, zvichiita kuti miniaturization, kunyatsoita, uye kubatanidzwa kwemagetsi masisitimu.
1. Tsanangudzo uye Basic Concepts yeSoC uye SiP
SoC (System paChip) - Kubatanidza iyo yese sisitimu kuita imwechete chip
SoC yakafanana neskyscraper, apo ese anoshanda modules akagadzirwa uye akabatanidzwa mune imwecheteyo yemuviri chip. Pfungwa huru yeSoC ndeyekubatanidza ese epakati zvikamu zvemagetsi system, kusanganisira processor (CPU), ndangariro, mamodule ekutaurirana, analog maseketi, sensor interfaces, uye mamwe akasiyana anoshanda mamodule, pane imwechete chip. Zvakanakira zveSoC zviri muhupamhi hwayo hwekubatanidza uye hukuru hudiki, huchipa zvakakosha mabhenefiti mukuita, mashandisiro emagetsi, uye zviyero, zvichiita kuti ive yakanyanya kukodzera kune yepamusoro-kuita, zvigadzirwa zvinonzwa simba. Iwo ma processor muApple smartphones mienzaniso yeSoC chips.
Kuenzanisira, SoC yakafanana ne "super building" muguta, umo mabasa ese akagadzirwa mukati, uye akasiyana mamodule anoshanda akafanana nepasi dzakasiyana: mamwe inzvimbo dzehofisi (processors), mamwe inzvimbo dzekuvaraidza (ndangariro), uye mamwe ari. ma network network (communication interfaces), ese akaiswa muchivako chimwechete (chip). Izvi zvinobvumira iyo yese sisitimu kushanda pane imwechete silicon chip, ichiwana yepamusoro kugona uye kuita.
SiP (System muPackage) - Kubatanidza machipi akasiyana pamwechete
Maitiro eSiP tekinoroji akasiyana. Zvakafanana nekurongedza akawanda machipisi ane akasiyana mabasa mukati meiyo imwechete yemuviri package. Iyo inotarisa kusanganisa akawanda anoshanda machipisi kuburikidza nekurongedza tekinoroji pane kuvabatanidza mune imwechete chip seSoC. SiP inobvumira akawanda machipisi (mapurosesa, ndangariro, RF machipisi, nezvimwewo) kuti aiswe padivi nepadivi kana kurongedzerwa mukati meiyo module imwe chete, ichigadzira system-level mhinduro.
Pfungwa yeSiP inogona kufananidzwa nekuunganidza bhokisi rekushandisa. Bhokisi rematurusi rinogona kunge riine zvishandiso zvakasiyana, senge screwdriver, sando, uye zvibooresa. Kunyangwe ari maturusi akazvimiririra, ese akabatana mubhokisi rimwe kuti ashandise zviri nyore. Kubatsira kweiyi nzira ndeyekuti chishandiso chega chega chinogona kugadzirwa uye kugadzirwa chakaparadzana, uye chinogona "kuunganidzwa" mupakeji yehurongwa sezvinodiwa, ichipa kuchinjika uye nekukurumidza.
2. Unyanzvi Hunhu uye Kusiyana pakati peSoC neSiP
Kubatanidza Method Misiyano:
SoC: Akasiyana anoshanda mamodule (akadai seCPU, ndangariro, I / O, nezvimwewo) akagadzirirwa zvakananga pane imwecheteyo silicon chip. Ese mamodule anogovana zvakafanana epasi maitiro uye dhizaini yedhizaini, ichigadzira yakabatanidzwa sisitimu.
SiP: Akasiyana anoshanda machipisi anogona kugadzirwa uchishandisa akasiyana maitiro uye obva asanganiswa mune imwechete yekurongedza module uchishandisa 3D yekurongedza tekinoroji kugadzira sisitimu yemuviri.
Dhizaini Yakaoma uye Kuchinjika:
SoC: Sezvo ese mamodule akabatanidzwa pane imwechete chip, iyo dhizaini yakaoma yakanyanya, kunyanya kune yekudyidzana dhizaini yemamodule akasiyana akadai sedhijitari, analog, RF, uye ndangariro. Izvi zvinoda mainjiniya kuve neyakadzama-domain dhizaini dhizaini. Uyezve, kana paine nyaya yekugadzira nechero module muSoC, iyo chip yese ingangoda kuvandudzwa, izvo zvinounza njodzi huru.
SiP: Mukupesana, SiP inopa yakakura dhizaini kuchinjika. Akasiyana anoshanda mamodule anogona kugadzirwa uye kusimbiswa zvakasiyana asati aiswa muhurongwa. Kana nyaya ikamuka nemodule, iyo chete module inoda kutsiviwa, ichisiya zvimwe zvikamu zvisina kukanganiswa. Izvi zvinobvumirawo kukurumidza kukurumidza kukurumidza uye njodzi dzakaderera zvichienzaniswa neSoC.
Maitiro Kuenderana uye Zvinetso:
SoC: Kubatanidza mabasa akasiyana akadai sedhijitari, analog, uye RF pane imwechete chip inotarisana nematambudziko akakura mukuenderana. Mamodule anoshanda akasiyana anoda akasiyana maitiro ekugadzira; semuenzaniso, maseketi edhijitari anoda yakakwira-kumhanya, yakaderera-simba maitiro, nepo analog maseketi angangoda kunyatso kudzora magetsi. Kuwana kuenderana pakati peaya maitiro akasiyana pane imwechete chip kwakaoma zvakanyanya.
SiP: Kuburikidza nekurongedza tekinoroji, SiP inogona kubatanidza machipisi anogadzirwa uchishandisa akasiyana maitiro, kugadzirisa maitiro ekuenderana nyaya akatarisana neSoC tekinoroji. SiP inobvumira akawanda heterogeneous machipi kuti ashande pamwechete mupakeji imwe chete, asi izvo zvinodikanwa zvepakeji tekinoroji zvakakwirira.
R&D Cycle uye Mariro:
SoC: Sezvo SoC ichida kugadzira uye kuona mamodule ese kubva kutanga, kutenderera kwedhizaini kwakareba. Imwe neimwe module inofanirwa kuomesesa dhizaini, kuoneswa, uye kuyedzwa, uye iyo yese yekuvandudza maitiro inogona kutora makore akati wandei, zvichikonzera kudhura kwakanyanya. Nekudaro, kamwe mukugadzirwa kwakawanda, mutengo weyuniti wakadzikira nekuda kwekubatanidzwa kwakanyanya.
SiP: Kutenderera kweR&D kupfupi kune SiP. Nekuti SiP inoshandisa zvakananga iripo, yakasimbiswa inoshanda machipi ekurongedza, inoderedza nguva inodiwa pakugadzirisazve module. Izvi zvinobvumira kukurumidza kutangwa kwechigadzirwa uye kudzikisa zvakanyanya mutengo weR&D.
Maitiro eSistimu uye saizi:
SoC: Sezvo ese mamodule ari pane imwechete chip, kunonoka kutaurirana, kurasikirwa kwesimba, uye kukanganiswa kwechiratidzo kunoderedzwa, zvichipa SoC mukana usingaenzaniswi mukuita uye kushandiswa kwesimba. Saizi yaro idiki, ichiita kuti ive yakakosha kune maapplication ane yakakwirira kuita uye simba zvinodiwa, senge smartphones uye mifananidzo yekugadzirisa machipisi.
SiP: Kunyangwe nhanho yekubatanidza yeSiP isina kukwira seiyo yeSoC, ichiri kukwanisa kurongedza machipisi akasiyana pamwe chete uchishandisa akawanda-layer kurongedza tekinoroji, zvichikonzera hukuru hudiki kana uchienzaniswa neyechinyakare multi-chip mhinduro. Uyezve, sezvo ma modules akaiswa munyama pane kubatanidzwa pane imwechete silicon chip, nepo kuita kungasaenderana neiyo yeSoC, inogona kuramba ichizadzisa zvinodiwa zveakawanda maapplication.
3. Mamiriro ekushandisa eSoC uye SiP
Mamiriro ekushandisa eSoC:
SoC inowanzo fanirwa kuminda ine zvakakwirira zvinodikanwa zvehukuru, mashandisiro emagetsi, uye kuita. Semuyenzaniso:
Mafonifoni: Iwo ma processors ari mumafoni efoni (akadai seApple's A-series machipisi kana Qualcomm's Snapdragon) anowanzo akabatanidzwa zvakanyanya SoCs anosanganisira CPU, GPU, AI processing units, kutaurirana modules, nezvimwewo, zvinoda zvese zvine simba kuita uye kuderera kwesimba kushandiswa.
Kugadziriswa Kwemifananidzo: Mumakamera edhijitari uye madrones, magadzirirwo emifananidzo anowanzoda akasimba akafanana ekugadzirisa masimba uye yakaderera latency, iyo SoC inogona kubudirira.
Yakakwira-Performance Embedded Systems: SoC inonyanya kukodzera kumidziyo midiki ine kuomarara kwesimba zvinodiwa, senge IoT zvishandiso uye zvinopfekeka.
Maitiro ekushandisa kweSiP:
SiP ine huwandu hwakakura hwemamiriro ekushandisa, akakodzera kuminda inoda kukurumidza kusimudzira uye akawanda-anoshanda kubatanidzwa, akadai se:
Kukurukurirana Equipments: Yezviteshi zvepasi, marouters, nezvimwe, SiP inogona kubatanidza akawanda RF uye dijitari masaini processors, ichimhanyisa kutenderera kwechigadzirwa.
Consumer Electronics: Kune zvigadzirwa senge smartwatches uye Bluetooth mahedhifoni, ayo ane kukurumidza kukwidziridza kutenderera, SiP tekinoroji inobvumira kukurumidza kuvhurwa kwezvitsva zvigadzirwa.
Zvemotokari zveMagetsi: Kudzora mamodule uye radar masisitimu mumotokari masisitimu anogona kushandisa SiP tekinoroji kukurumidza kubatanidza akasiyana anoshanda mamodule.
4. Remangwana Rekuvandudza Maitiro eSoC uye SiP
Maitiro muSoC Development:
SoC icharamba ichishanduka yakanangana nekubatana kwepamusoro uye kusanganisa kwakasiyana-siyana, zvingangosanganisira kuwedzera kubatanidzwa kweAI processors, 5G yekutaurirana modules, uye mamwe mabasa, ichityaira kumwe kushanduka kwemidziyo yakangwara.
Maitiro muSiP Development:
SiP ichawedzera kuvimba nematekinoroji epamberi, senge 2.5D uye 3D yekurongedza kufambira mberi, kurongedza machipisi ane maitiro akasiyana uye mabasa pamwe chete kusangana nekukurumidza kuri kuchinja kudiwa kwemusika.
5. Mhedziso
SoC yakafanana nekuvaka multifunctional super skyscraper, inotarisisa ese anoshanda mamodule mudhizaini imwe, akakodzera maapplication ane zvakanyanyisa zvinodiwa pakuita, saizi, uye mashandisiro emagetsi. SiP, kune rumwe rutivi, yakafanana ne "kurongedza" akasiyana anoshanda machipisi muhurongwa, achitarisa zvakanyanya pakuchinjika uye kukurumidza kusimudzira, kunyanya yakakodzera kumagetsi evatengi anoda kukurumidza kugadzirisa. Vese vari vaviri vane masimba avo: SoC inosimbisa yakakwana sisitimu mashandiro uye saizi optimization, nepo SiP inosimbisa sisitimu kuchinjika uye optimization yekutenderera kutenderera.
Nguva yekutumira: Oct-28-2024