QFN neDFN, marudzi maviri aya e semiconductor component packaging, anowanzo vhiringidzwa zviri nyore mubasa rekushanda. Kazhinji hazvizivikanwe kuti ndeipi QFN uye ndeipi DFN. Saka, tinofanira kunzwisisa kuti QFN chii uye kuti DFN chii.
QFN rudzi rwekurongedza. Ndiro zita rinotsanangurwa neJapan Electronics and Machinery Industries Association, rine bhii rekutanga rezwi rimwe nerimwe reChirungu rine mabhii makuru. MuchiChinese, rinonzi "square flat no-lead package."
DFN ishoko rekuwedzera reQFN, iro bhii rekutanga rezwi rimwe nerimwe rematatu echiRungu rakanyorwa nemabhii makuru.
Mapini eQFN packaging akapararira kumativi ese mana epakeji uye chitarisiko chose chakaenzana.
Mapini eDFN packaging akapararira kumativi maviri epakeji uye chitarisiko chose chakaita sedenderedzwa.
Kuti musiyanise pakati peQFN neDFN, munongofanira kufunga nezvezvinhu zviviri chete. Chekutanga, tarisai kana mapini ari pamativi mana kana maviri. Kana mapini ari pamativi ese mana, iQFN; kana mapini ari pamativi maviri chete, iDFN. Chechipiri, fungai kana chitarisiko chose chiri chesikweya kana cherectangular. Kazhinji, chitarisiko chesikweya chinoratidza QFN, nepo chitarisiko cherectangular chinoratidza DFN.
Nguva yekutumira: Kurume-30-2024