QFN neDFN, aya marudzi maviri e semiconductor component packaging, anowanzo vhiringika zviri nyore mubasa rinoshanda. Kazhinji hazvizivikanwe kuti ndeipi QFN uye ndeipi iri DFN. Naizvozvo, tinofanira kunzwisisa kuti QFN chii uye kuti DFN chii.
QFN imhando yekurongedza. Iri izita rinotsanangurwa neJapan Electronics uye Machinery Industries Association, ine vara rekutanga rerimwe remazwi matatu echiRungu akaiswa mazita. MuchiChinese, inonzi "square flat no-lead package."
DFN kuwedzera kweQFN, ine vara rekutanga rerimwe remazwi matatu echiRungu akaiswa mazita makuru.
Mapini eQFN kurongedza akagovaniswa pamativi mana epakeji uye kutaridzika kwese kwakaenzana.
Mapini eDFN kurongedza akagovaniswa pamativi maviri epakeji uye chitarisiko chose chine rectangular.
Kuti usiyanise pakati peQFN neDFN, unongoda kufunga zvinhu zviviri. Kutanga, tarisa kuti mapini ari kumativi mana here kana maviri. Kana mapini ari kumativi mana, iQFN; kana mapini ari pamativi maviri chete, iri DFN. Chechipiri, funga kuti chitarisiko chose chine sikweya here kana kuti rectangular. Kazhinji, chitarisiko che square chinoratidza QFN, nepo rectangular chitarisiko chinoratidza DFN.
Nguva yekutumira: Mar-30-2024