Musi waChivabvu 26, zvakanzi Foxconn anga achifunga kubhadharira iyo Singapore-based semiconductor packaging uye yekuyedza kambani United Test uye Assembly Center (UTAC), ine mukana wekutengesa mutengo unosvika US $ 3 bhiriyoni. Sekutaura kwevari mukati meindasitiri, kambani yevabereki veUTAC, Beijing Zhilu Capital, yakahaya bhanga rekudyara reJefferies kuti ritungamire kutengeswa uku uye iri kutarisirwa kuwana chikamu chekutanga mukupera kwemwedzi uno. Pari zvino hapana bato rati rataura nezvenyaya iyi.
Izvo zvakakosha kuti tizive kuti UTAC dhizaini dhizaini mu mainland China inoita kuti ive chinangwa chakakodzera kune vasiri veUS strategic investigative. Semugadziri mukuru wepasirese wekugadzira zvigadzirwa zvemagetsi uye mutengesi mukuru kuApple, Foxconn yakawedzera mari yayo muindasitiri yesemiconductor mumakore achangopfuura. Yakatangwa muna 1997, UTAC inyanzvi yekurongedza uye yekuyedza kambani ine bhizinesi mundima dzakawanda dzinosanganisira zvemagetsi zvevatengi, komputa michina, chengetedzo uye zvekurapa. Iyo kambani ine mabhesi ekugadzira muSingapore, Thailand, China neIndonesia, uye inoshandira vatengi vanosanganisira fabless dhizaini makambani, akasanganiswa ekugadzira zvigadzirwa (IDMs) uye wafer foundries.
Kunyangwe UTAC isati yaburitsa data chairo remari, zvinonzi EBITDA yayo yepagore ingangoita US$300 miriyoni. Tichipesana nemashure ekuenderera mberi kwekugadzirisa indasitiri yepasirese semiconductor, kana kutengeserana uku kwaitwa, hakungo wedzera kugona kweFoxconn kwakatwasuka muchikamu chekugovera chip, asi kuchave nekukanganisa kwakadzama pane yepasirese semiconductor supply chain landscape. Izvi zvinonyanya kukosha kana paine makwikwi ari kuramba achityisa etekinoroji pakati peChina neUnited States, uye kutariswa kuri kuitwa mubatanidzwa wemaindasitiri nekutenga kunze kweUnited States.
Nguva yekutumira: Jun-02-2025