bhana rekesi

Nhau dzeIndasitiri: Musika wePackaging weSemiconductor Wepasirose Unoramba Uchikura Zvakasimba muna 2026

Nhau dzeIndasitiri: Musika wePackaging weSemiconductor Wepasirose Unoramba Uchikura Zvakasimba muna 2026

Musika wepasi rose we semiconductor packaging and testing market unotarisirwa kuramba uchikura muna 2026, zvichikonzerwa nekuwedzera kwekuda kubva kuhungwaru hwekugadzira, zvemagetsi zvemotokari, uye komputa inoshanda zvakanyanya.

Musika wePackaging weSemiconductor wepasi rose unoenderera mberi nekukura kwakasimba muna 2026

Vanoongorora maindasitiri vanoti matekinoroji epamusoro ekurongedza, anosanganisira kurongedza kwewafer-out wafer-level (FOWLP), kurongedza kwe2.5D ne3D, ari kuramba achikosha sezvo vagadziri vemachipisi vachitsvaga kubatanidzwa kwakanyanya uye zvinhu zvidiki zvechimiro.

Kukura kwekudyara mari muzvigadzirwa zve semiconductor pasi rose kunotsigirawo kukura kwecheni yekurongedza. Sezvo zvishandiso zvemagetsi zvichiwedzera kuchenjera uye zvakabatana, kudiwa kwemhinduro dzekupaka dzakavimbika uye dzakarurama kucharamba kwakasimba muzvikamu zvevatengi, maindasitiri, uye mota.


Nguva yekutumira: Kurume-02-2026