Iyo mota chip indasitiri iri kuita shanduko
Munguva pfupi yapfuura, semiconductor engineering timu yakakurukura machipisi madiki, mahybrid bonding, uye zvinhu zvitsva naMichael Kelly, Mutevedzeri weMutungamiriri weAmkor diki chip uye FCBGA yekubatanidza. Vakapindawo munhaurirano iyi vaive muongorori weASE William Chen, CEO wePromex Industries Dick Otte, naSander Roosendaal, R&D Director weSynopsys Photonics Solutions. Pazasi pane zvidimbu zvenhaurirano iyi.
Kwemakore akawanda, kugadzirwa kwemotokari machipisi hakuna kutora chinzvimbo chinotungamira muindasitiri. Zvisinei, nekukwira kwemotokari dzemagetsi uye kugadzirwa kwepamusoro infotainment systems, mamiriro ezvinhu aya achinja zvikuru. Ndedzipi nyaya dzawaona?
Kelly: High-end ADAS (Advanced Driver Assistance Systems) inoda ma processors ane 5-nanometer process kana madiki kuti ave nemakwikwi mumusika. Paunenge uchinge wapinda 5-nanometer process, iwe unofanirwa kufunga nezve wafer mutengo, izvo zvinotungamira kunyatso tarisisa madiki chip mhinduro, sezvo zvakaoma kugadzira machipisi makuru pa5-nanometer process. Pamusoro pezvo, goho racho rakaderera, zvichikonzera kudhura kwakanyanya. Paunenge uchibata ne5-nanometer kana mamwe maitiro epamberi, vatengi vanowanzofunga kusarudza chikamu che 5-nanometer chip pane kushandisa iyo chip yese, uku vachiwedzera mari muchikamu chekurongedza. Vanogona kufunga kuti, "Ingave sarudzo inodhura-inoshanda kuti uwane kuita kunodiwa nenzira iyi, pane kuedza kupedzisa mabasa ese mune yakakura chip?" Saka, hongu, makambani emotokari epamusoro ari kunyatsoteerera kune diki chip tekinoroji. Makambani ari kutungamira mumaindasitiri ari kutarisisa izvi. Zvichienzaniswa nendima yekombuta, indasitiri yemotokari ingangove makore maviri kusvika mana kumashure mukushandiswa kwediki chip tekinoroji, asi maitiro ekushandiswa kwayo muchikamu chemotokari akajeka. Indasitiri yemotokari ine zvakanyanyisa kuvimbika zvinodiwa, saka kuvimbika kwediki chip tekinoroji kunofanirwa kuratidzwa. Nekudaro, yakakura-chiyero kushandiswa kwediki chip tekinoroji mumunda wemotokari zvirokwazvo iri munzira.
Chen: Handisati ndaona zvipingamupinyi zvakakosha. Ini ndinofunga zviri pamusoro pekuda kudzidza uye kunzwisisa zvinoenderana nezvinodiwa zvetifiketi zvakadzama. Izvi zvinodzokera kuchikamu chemetrology. Isu tinogadzira sei mapakeji anoenderana neyakaomesesa mota zviyero? Asi ichokwadi kuti tekinoroji yakakodzera iri kuramba ichibuda.
Tichifunga nezvenyaya dzakawanda dzekupisa uye kuomarara kwakabatana neakawanda-anofa zvikamu, kuchave nekutsva kwekushushikana bvunzo profiles kana akasiyana marudzi ebvunzo? Zviyero zvazvino zveJEDEC zvinogona kuvhara masisitimu akabatanidzwa akadaro?
Chen: Ndinotenda kuti tinofanira kuumba nzira dzakadzama dzekuongorora kuti tinyatsoona kwakabva kukundikana. Takurukura kusanganisa metrology nediagnostics, uye isu tine basa rekuona kuti tingavaka sei mamwe akasimba mapakeji, kushandisa emhando yepamusoro zvinhu uye maitiro, uye nekuzvisimbisa.
Kelly: Mazuva ano, tiri kuita zvidzidzo zvemakesi nevatengi, avo vakadzidza chimwe chinhu kubva ku-system-level test, kunyanya tembiricha yekukanganisa bvunzo mumashandiro ebhodhi bvunzo, izvo zvisina kufukidzwa mukuedzwa kweJEDEC. Kuyedzwa kweJEDEC kungoyedza isothermal, inosanganisira "kukwira kwetembiricha, kudonha, uye shanduko yekushisa." Nekudaro, iyo tembiricha yekugovera mumapakeji chaiwo iri kure nezvinoitika munyika chaiyo. Vatengi vanowedzera vanoda kuitisa system-level yekuyedza nekukurumidza nekuti vanonzwisisa mamiriro aya, kunyangwe asiri munhu wese anozviziva. Simulation tekinoroji inoitawo basa pano. Kana munhu aine hunyanzvi mukupisa-mechini musanganiswa simulation, kuongorora matambudziko kunova nyore nekuti ivo vanoziva kuti ndezvipi zvinhu zvekutarisa panguva yekuyedzwa. System-level yekuyedza uye simulation tekinoroji inowirirana. Zvisinei, tsika iyi ichiri kutanga.
Pane zvakawanda zvinopisa zvekugadzirisa here kune vanhu vakuru tekinoroji node kupfuura kare?
Otte: Ehe, asi mumakore akati wandei apfuura, nyaya dzekubatana dzave kuwedzera mukurumbira. Tinoona 5,000 kusvika 10,000 mbiru dzemhangura pachip, dzakaparadzaniswa pakati pe50 microns uye 127 microns zvakaparadzana. Kana iwe ukanyatsoongorora data rakakodzera, iwe uchaona kuti kuisa mbiru idzi dzemhangura pane substrate uye kuita kupisa, kutonhora, uye reflow soldering mashandiro zvinoda kuwana chikamu chimwechete mune zana rezviuru coplanarity nemazvo. Chikamu chimwe mukunyatsokwana zviuru zana chakafanana nekuwana chipande chouswa mukati meurefu hwenhandare yenhabvu. Isu takatenga mamwe epamusoro-kuita Keyence maturusi ekuyera flatness yechip uye substrate. Ehe, mubvunzo unotevera ndewekuti ungadzora sei chiitiko ichi chehondo panguva yekutenderera solder? Iyi inyaya iri kunetsa inoda kugadziriswa.
Chen: Ndinoyeuka kukurukurirana pamusoro pePonte Vecchio, kwavakashandisa solder yepasi-tembiricha pakufunga kwegungano pane zvikonzero zvekuita.
Tichifunga kuti ese masekete ari pedyo achine nyaya dzekupisa, mafotonics anofanira kubatanidzwa sei mune izvi?
Roosendaal: Thermal simulation inofanirwa kuitwa kune ese maficha, uye yakakwirira-frequency kudhirowa kunodiwa zvakare nekuti masaini anopinda masaini epamusoro-frequency. Naizvozvo, nyaya dzakaita senge impedance yekufananidza uye kudzika kwakakodzera kunoda kugadziriswa. Panogona kuve neakakosha tembiricha gradients, anogona kunge aripo mukati mekufa pachayo kana pakati peyatinodaidza kuti "E" kufa (yemagetsi kufa) uye "P" kufa (photon kufa). Ndiri kuda kuziva kana tichida kuzama zvakadzama mukati mekupisa kwezvinonamira.
Izvi zvinomutsa nhaurirano pamusoro pezvinhu zvekubatanidza, kusarudzwa kwavo, uye kugadzikana nekufamba kwenguva. Zviripachena kuti hybrid bonding tekinoroji yakashandiswa munyika chaiyo, asi haisati yashandiswa mukugadzirwa kwehuwandu. Ndeapi mamiriro azvino ehunyanzvi uhu?
Kelly: Mapato ese ari muchikamu chekugovera ari kuterera kune yakasanganiswa bonding tekinoroji. Parizvino, tekinoroji iyi inonyanya kutungamirwa nevakawana, asi OSAT (Outsourced Semiconductor Assembly uye Test) makambani ari kudzidzawo zvakadzama mashandisirwo ayo ekutengesa. Classic copper hybrid dielectric bonding zvikamu zvakave nekusimbiswa kwenguva refu. Kana utsanana huchigona kudzorwa, nzira iyi inogona kuburitsa zvinhu zvakasimba. Nekudaro, ine yakanyanya kucheneswa zvinodiwa, uye mutengo wemidziyo mukuru wakakwira zvakanyanya. Isu takasangana nekuedza kwekutanga kwekushandisa mu AMD's Ryzen chigadzirwa mutsara, uko mazhinji eSRAM akashandisa copper hybrid bonding tekinoroji. Nekudaro, ini handisati ndaona vamwe vatengi vazhinji vachishandisa tekinoroji iyi. Kunyangwe iri pamatekinoroji emigwagwa yemakambani mazhinji, zvinoita sekunge zvichatora mamwe makore mashoma kuti masutu emidziyo ane hukama asangane nekuzvimiririra kwehutsanana zvinodiwa. Kana iyo inogona kuiswa munzvimbo yefekitori ine hutsanana hushoma pane yakajairwa wafer fab, uye kana mutengo wakaderera uchigona kuwanikwa, pamwe iyi tekinoroji ichagamuchira kutariswa kwakawanda.
Chen: Zvinoenderana nenhamba dzangu, mapepa makumi matatu nemanomwe ekubatanidza bonding achaunzwa kumusangano weECTC wa2024. Iri idanho rinoda hunyanzvi hwakawanda uye rinosanganisira huwandu hwakakosha hwekushanda kwakanaka panguva yekuungana. Saka tekinoroji iyi ichaona kushandiswa kwakapararira. Patova nemamwe makesi ekushandisa, asi mune ramangwana, zvichave zvakanyanya kuwanda munzvimbo dzakasiyana siyana.
Paunotaura nezve "zvakanaka mashandiro," uri kureva kudiwa kwekudyara kwakakosha kwemari?
Chen: Zvechokwadi, zvinosanganisira nguva uye unyanzvi. Kuita basa iri kunoda nharaunda yakachena kwazvo, izvo zvinoda kuisirwa mari. Inodawo michina yakabatana, iyo inodawo mari. Saka izvi zvinosanganisira kwete mari yekushandisa chete asiwo kuisa mari muzvivakwa.
Kelly: Kana paine kupatsanurwa kwemamicron gumi neshanu kana kupfuura, pane fariro huru pakushandisa tekinoroji yecopper pillar wafer-to-wafer. Nenzira yakanaka, mawaferi akati sandara, uye saizi yechip haina kunyanyokura, ichibvumira kuyerera kwepamusoro-soro kune mamwe eaya spacings. Nepo izvi zvichipa mamwe matambudziko, hazvina kudhura zvakanyanya pane kuzvipira kune copper hybrid bonding tekinoroji. Nekudaro, kana iyo chaiyo inodiwa iri 10 microns kana yakaderera, mamiriro anochinja. Makambani anoshandisa chip stacking tekinoroji anowana imwe-digit micron spacings, senge 4 kana 5 microns, uye hapana imwe nzira. Naizvozvo, iyo yakakodzera tekinoroji ichave isingadzivisike kukura. Nekudaro, matekinoroji aripo ari kuramba achivandudza. Saka ikozvino tiri kutarisa pamiganho iyo mbiru dzemhangura dzinogona kuwedzera uye kuti tekinoroji iyi ichagara kwenguva yakareba zvakaringana kuti vatengi vanonoke dhizaini yese uye "kufanirwa" kusimudzira kudyara mune yechokwadi copper hybrid bonding tekinoroji.
Chen: Tichangotora matekinoroji akakodzera kana paine kudiwa.
Pane zvakawanda zvitsva zviri kuitika mumunda we epoxy molding compound parizvino?
Kelly: Mishonga yekuumba yakachinja zvikuru. CTE yavo (coefficient of thermal expansion) yakaderedzwa zvakanyanya, zvichiita kuti vawedzere kufarira maapplication akakodzera kubva pakuona kwekumanikidza.
Otte: Kudzokera kunhaurirano yedu yapfuura, mangani semiconductor machipisi ari kugadzirwa ne1 kana 2 micron spacing?
Kelly: Chikamu chakakosha.
Chen: Pamwe isingasviki 1%.
Otte: Saka tekinoroji yatiri kukurukura haina kufambiswa. Haisi muchikamu chekutsvagisa, sezvo makambani anotungamira ari kushandisa tekinoroji iyi, asi inodhura uye ine goho rakaderera.
Kelly: Izvi zvinonyanya kushandiswa mune yepamusoro-inoshanda komputa. Mazuva ano, haishandiswe kwete munzvimbo dzedata chete asiwo mumakomputa epamusoro uye kunyangwe mamwe maturusi anobatwa nemaoko. Kunyangwe midziyo iyi idiki, ichine mashandiro epamusoro. Nekudaro, mune yakafara mamiriro e processors uye CMOS application, chikamu chayo chinoramba chiri chidiki. Kune vakajairwa chip vagadziri, hapana chikonzero chekutora tekinoroji iyi.
Otte: Ndosaka zvichishamisa kuona tekinoroji iyi ichipinda muindasitiri yemotokari. Mota hadzidi machipisi kuti dzive diki zvakanyanya. Ivo vanogona kuramba vari pamakumi maviri kana makumi mana nanometer maitiro, sezvo mutengo pa transistor mune semiconductors wakadzikira pakuita uku.
Kelly: Zvisineyi, zvinodikanwa zvemakombuta zveADAS kana kutyaira uchizvitonga zvakafanana neizvo zveAI PC kana zvimwe zvakafanana. Naizvozvo, iyo indasitiri yemotokari inoda kuisa mari mune aya ekucheka-kumucheto matekinoroji.
Kana kutenderera kwechigadzirwa kuri makore mashanu, kutora matekinoroji matsva kunowedzera mukana wemamwe makore mashanu here?
Kelly: Ndiyo pfungwa ine musoro. Indasitiri yemotokari ine imwe kona. Funga zviri nyore servo controllers kana zviri nyore analog zvishandiso zvave zviripo kwemakore makumi maviri uye zvakaderera-mutengo wakaderera. Vanoshandisa machipisi madiki. Vanhu vari muindasitiri yemotokari vanoda kuramba vachishandisa zvigadzirwa izvi. Ivo vanongoda kuisa mari mumidziyo yepamusoro-yekupedzisira komputa ine dijitari diki machipisi uye pamwe nekuabatanidza neanodhura analog machipisi, flash memory, uye RF machipisi. Kwavari, iyo diki chip modhi inoita pfungwa yakawanda nekuti vanogona kuchengetedza yakawanda yakaderera, yakagadzikana, chizvarwa chekare zvikamu. Havadi kushandura zvikamu izvi uye havadi. Zvadaro, ivo vanongoda kuwedzera yakakwirira-yekupedzisira 5-nanometer kana 3-nanometer diki chip kuzadzisa mabasa echikamu cheADAS. Muchokwadi, ivo vari kushandisa akasiyana marudzi ediki machipisi mune chimwe chigadzirwa. Kusiyana nePC uye minda yemakomputa, iyo indasitiri yemotokari ine akawanda akasiyana siyana ekushandisa.
Chen: Uyezve, aya machipisi haafanire kuisirwa padivi peinjini, saka mamiriro ekunze ari nani.
Kelly: Tembiricha yemhoteredzo mumotokari yakakwira zvakanyanya. Naizvozvo, kunyangwe simba reiyo chip risiri kunyanya kukwira, indasitiri yemotokari inofanirwa kuisa imwe mari mune yakanaka yekupisa manejimendi mhinduro uye inogona kutofunga kushandisa indium TIM (thermal interface zvinhu) nekuti mamiriro ekunze ane hukasha.
Nguva yekutumira: Kubvumbi-28-2025