Semiconductor Packing yakamuka kubva kune yechinyakare 1D PCB magadzirirwo ekucheka-gedhi 3d hybrid kusungwa pane wafer level. Kufambira mberi uku kunobvumidza kushamwaridzana mune imwechete-manhamba micron huwandu, neBandwidths of inosvika 1000 GB / S, nepo kuchengetedza kwakakwirira simba. PaCore of AdvonDudeductor Packactor mapepa epackagiologies ndeye 2.5D packaging Aya matekinoroji akakosha mune ramangwana reHPC masisitimu.
2.5D Packagation tekinoroji inosanganisira akasiyana-siyana emartermedies zvinhu, imwe neimwe nezvigadzirwa zvayo uye zvakashata. Silishon (si) Mifananidzo yemartermeary Nekudaro, ivo vanodhura maererano nezvinhu uye kugadzira uye kutarisana zvisingakwanisi munzvimbo dzekutakura. Kuti uderedze nyaya idzi, kushandiswa kweanowanikwa silicon mabhiriji ari kuwedzera, kushandisa zvine hunyanzvi kushandisa silicon uko kushandisa kwakanaka kune basa rekutsoropodza nguva yekugadzirisa nzvimbo.
Organic Intermediary Layers, uchishandisa purasitiki dzakaumbwa, ndedzimwe chinhu chinodhura-chinoshanda kune silicon. Ivo vane yakaderera dielelectric nguva dzose, iyo inoderedza rc kunonoka kwepakeji. Kunyangwe izvi zvakanakira, organic lates vanonetsekana kuti kuganhurira chikamu chekusangana kwechiitiko chekudzikisira seSilicon-based kurongedza, kudzikamisa kwavo kuyamadzwa kwecomputer.
Girazi remagetsi mitezo dzakakoshesa kukosha, kunyanya kutevera nzvimbo yekuvhunduka kwemukati yemotokari-yakavakirwa muyedzo wekubhadhara mota. Girazi rinopa zvinoverengeka zvakanakira, zvakadai zvekuwedzera kwekuwedzera kwekuwedzera Nekudaro, parutivi kubva kune zvinetso zvehunyanzvi, iyo huru yekudhara yemaruva emaruva ndeyekuita kwematanho ezvematongerwo enyika uye kushaya mari yekugadzira yakakura. Sezvo macosystem akawanda uye anogadzira zvigadzirwa zvinovandudza, girazi-based technologies mumicononductor paakiti inogona kuona kukura uye kuitwe.
Panyaya ye 3D packaging tekinoroji, cu-cu bump-shoma hybrid kusungwa kuri kuita tekinoroji inotungamirwa. Iyi nzira yepamusoro inowana nzvimbo isingaperi yekusangana nekubatanidza dielectric zvinhu (kunge Sio2) ine yakamiswa metals (cu). Cu-cu Hybrid kusungwa kunogona kuzadzisa zvipfeve pazasi gumi micron, inomiririra kugadzirisa kwakakosha pamusoro pechinyakare micro-bump tekinoroji, iyo ine mapepa emagetsi anenge 40-50 macomputer. Zvakanakisa zvehybrid kusungwa zvinosanganisira kuwedzerwa i / o, kuvandudzwa bandwidth, zvakavandudzika kushamwaridzana, uye kuderedza kupokana neparasitiki uye kudzikisira kupesana nekuda kwekusavapo kwekuzara. Nekudaro, iyi tekinoroji yakaoma kuti igadzire uye ine mari yakakwira.
2.5D uye 3D mapepa ekukoka matekiniki anokonzeresa akasiyana ekuisa mataurirwo emhando. Mu2,5d kurongedza, zvichienderana nesarudzo yezvinhu zvemararami, zvinogona kuunganidzwa muLilicon-based, zvakavakirwa-zvakavakirwa mitezo, sezvakaratidzwa mumufananidzo uri pamusoro. Mukati me 3D kurongedza, kusimudzira kwecroction tekinoroji kunovavarira kuderedza zviyero zvekuparadza, zvakananga Cu-cu-cu-cu-manhamba manhamba anokwanisa kuwanikwa, kumaka kufambira mberi kwakakosha mumunda.
.
1. Tsmc mutengesi we2,5D Silicon Intermediary lates for Navidaa uye mamwe anotungamira HPC anovandudza kugadzirwa kweGoogle kugadzirwa kweiyo its Idtechex inotarisira iyi maitiro kuti ienderere mberi, nekuenderera mberi nekufambira mberi kwakataurwa mumushumo wayo kufukidza vatambi vakuru.
2. ** Panel-level Packaging: Iyi nzira yekuisa inobvumidza kushandiswa kweiyo yakakura yemararamo marara uye inobatsira kuderedza mitengo nekugadzira mamwe mapakeji panguva imwe chete. Kunyangwe zvarinogona kuita, zvinonetsa senge manejimendi ekurwa achiri kuda kugadziriswa. Mukurumbira wayo wekuwedzera unoratidza kudiwa kwekukura kweakakura, zvimwe zvinodhura-zvinobudirira mumirauro marara.
3. ** Girazi Rondedzero Zvikamu: Magirazi emararamiro anoenderana neanorongedzo nePanes-level paylking, achipa mukana wekusimba kweropa pane imwe mari inokatyamadza, ichiita kuti isimbise yekupa kwemangwana matekinoroji emangwana.
4. Iyi tekinoroji yakashandiswa mune dzakasiyana-siyana dzekupedzisira server zvigadzirwa, kusanganisira AMD EPYCE YAKAITWA SRAM uye CPU, pamwe nemicues yekugadzirisa CPU / GPU Mabhokisi pane I / O Fues. Kubatira hybrid kunotarisirwa kutamba basa rakakosha mune ramangwana hbm kufambira mberi, kunyanya kune drama stacks kupfuura 16-hi kana 20-hi-hi-hi-hi zviyero.
5. CO-Pacal Optical zvishandiso (CPO) ari kuita mhinduro yakakosha yekuvandudza i / o bandwidth uye kuderedza kushandiswa kwesimba. Kuenzaniswa neyemagetsi emagetsi kutapurirana, kutaurirana kweye Optication kunopa zvakanakira zvakawanda, kusanganisira kufumurwa chiratidzo chechirwere chehurefu, kuderedzwa kwekunzwa crosstiscal, uye kuwedzera zvakanyanya bandwidth. Izvi zvakanakira kuita CPO sarudzo yakanaka yedata-yakanyanya, simba-inoshanda HPC masisitimu.
** Maketi akakosha kuti utarise: **
Iyo yekutanga musika uchityaira kukura kwe2,5d uye 3D mapepa epackagigiologies haina ruzivo rwekukasira-performance computing (HPC) chikamu. Aya maitiro epamusoro ekurongedza akakosha kuti akurire zvausingakwanisi pamitemo yaMoore, achigonesa vatengesi vazhinji, ndangariro, uye nhengo dzepakati mukati mekodhi imwe. Kuora kwemachipiti kunobvumidzawo kune yakakwana yekushandiswa kwemaitiro ehurongwa hwakasiyana hwekuita, sekuparadzanisa ini / o zvidhinha kuti zviwedzere kushanda.
Kuwedzera kune yakakwirira-performance computer (HPC), mamwe misika inotarisirwawo kuwana kukura kuburikidza nekugamuchirwa kwedanho rekodhi rekodhi. Mune 5G uye 6G zvikamu, zvigadzirwa zvakadai sekuisa matendennas eAndennas uye kudengenyeka-Edge-Edge-Edge Solutions kuchagadzira ramangwana rekushandisa network network (Rad) architectures. Motokari dzekuvimbika dzichabatsirwawo, sezvo idzi tekinoroji inotsigira kuunganidzwa kweSensor Suites uye computing zvikamu zve data apo ichokwadi, kuvimbika, kuenzanisa, simba uye kuronga uye nekubata-kwemutengo.
Zvevatengi zvemagetsi (kusanganisira smartphones, smartwatches, ar / vr zvishandiso, maPC, uye mashandiro emahara) ari kuwedzera kutarisisa data munzvimbo diki, kunyangwe kusimbisa kukuru pamutengo. Yepamberi Semiconductor Packating ichatamba yakakosha basa mune izvi maitiro, kunyangwe nzira dzekutakura dzinogona kusiyana neiyo dzinoshandiswa muHPC.
Kutumira Nguva: Oct-07-2024