Semiconductor packaging yakashanduka kubva kune yechinyakare 1D PCB magadzirirwo kuenda kukucheka-kumucheto 3D hybrid bonding padanho rewafer. Kufambira mberi uku kunobvumira kubatanidza nzvimbo mune imwechete-digit micron renji, ine bandwidths anosvika 1000 GB/s, uku ichichengetedza yakakwira simba. Pakati peiyo yepamusoro semiconductor yekurongedza matekinoroji ndeye 2.5D kurongedza (apo zvikamu zvinoiswa padivi padivi pane yepakati layer) uye 3D kurongedza (inosanganisira vertically kurongedza anoshanda machipisi). Aya matekinoroji akakosha kune ramangwana reHPC masisitimu.
2.5D yekurongedza tekinoroji inosanganisira akasiyana epakati layer zvinhu, imwe neimwe iine zvayakanakira nezvayakaipira. Silicon (Si) mativi epakati, anosanganisira akazara passive silicon wafers uye emunharaunda silicon mabhiriji, anozivikanwa nekupa akanakisa wiring kugona, achivaita akanakira yepamusoro-inoshanda komputa. Nekudaro, iwo anodhura maererano nezvinhu uye kugadzira uye nekupikiswa kwechiso munzvimbo yekurongedza. Kudzikamisa nyaya idzi, kushandiswa kwemabhiriji e-silicon emunharaunda kuri kuwedzera, kushandisa silicon zvine hungwaru uko kushanda kwakanaka kwakakosha paunenge uchigadzirisa zvimhingamipinyi zvenzvimbo.
Organic intermediary layers, uchishandisa fan-out mapurasitiki akaumbwa, ndiyo inodhura-inoshanda imwe nzira kune silicon. Ivo vane yakaderera dielectric nguva dzose, iyo inoderedza RC kunonoka mupakeji. Pasinei nezvakanakira izvi, organic intermediary layers inonetsekana kuti iwane iyo yakafanana nhanho yekubatanidza chimiro kuderedzwa sesilicon-based packaging, kudzikisira kutorwa kwavo mune yepamusoro-inoshanda komputa maapplication.
Girazi repakati akaturikidzana akawana kufarira kwakanyanya, kunyanya zvichitevera kuvhurwa kweIntel ichangoburwa yegirazi-yakavakirwa bvunzo mota kurongedza. Girazi rinopa zvakati wandei zvakanakira, senge inogadziriswa coefficient yekuwedzera kwekushisa (CTE), kudzikama kwepamusoro, nzvimbo dzakatsetseka uye dzakati sandara, uye kugona kutsigira kugadzirwa kwepaneru, zvichiita kuti ive mumiriri anovimbisa wepakati akaturikidzana ane wiring kugona kuenzaniswa nesilicon. Nekudaro, kunze kwezvinetso zvehunyanzvi, iyo huru yekudzosa yegirazi yepakati akaturikidzana ndeye immature ecosystem uye kushomeka kwazvino kwehukuru hwekugadzira huwandu. Sezvo iyo ecosystem inokura uye kugona kugadzira kunowedzera, girazi-yakavakirwa matekinoroji mune semiconductor packaging inogona kuona kumwe kukura uye kutorwa.
Panyaya ye 3D yekurongedza tekinoroji, Cu-Cu bump-isina hybrid bonding iri kuve inotungamira yekuvandudza tekinoroji. Iyi tekinoroji yepamusoro inowana kubatana kwekusingaperi nekubatanidza dielectric zvinhu (seSiO2) nesimbi dzakaiswa (Cu). Cu-Cu hybrid bonding inogona kuwana spacings pazasi 10 microns, kazhinji mune imwechete-digit micron renji, inomiririra kuvandudzwa kwakakura pamusoro pechinyakare micro-bump tekinoroji, ine bump spacings inosvika makumi mana-50 microns. Zvakanakira zvehybrid bonding zvinosanganisira kuwedzera I/O, yakakwidziridzwa bandwidth, yakagadziridzwa 3D vertical stacking, zvirinani simba rekushanda, uye kuderedzwa kweparasitic mhedzisiro uye kupisa kwekupisa nekuda kwekushaikwa kwekuzadzwa kwepasi. Nekudaro, tekinoroji iyi yakaoma kugadzira uye ine mutengo wakakwira.
2.5D uye 3D yekurongedza matekinoroji inosanganisira akasiyana siyana ekurongedza. Mune 2.5D kurongedza, zvichienderana nesarudzo yepakati-ye layer zvinhu, inogona kuiswa musilicon-based, organic-based, uye girazi-based intermediary layers, sezvakaratidzwa mumufananidzo uri pamusoro. Mune 3D kurongedza, kuvandudzwa kweiyo micro-bump tekinoroji ine chinangwa chekudzikisa nzvimbo, asi nhasi, nekutora hybrid bonding tekinoroji (yakananga Cu-Cu yekubatanidza nzira), imwe-dijiti yepakati nzvimbo inogona kuwanikwa, zvichiratidza kufambira mberi kwakakosha mumunda. .
**Makiyi Tekinoroji Mafambiro ekuona:**
1. **Hombe Intermediary Layer Areas:** IDTechEx yakambofanotaura kuti nekuda kwekuoma kwesilicon intermediary layers kudarika 3x reticle size limit, 2.5D silicon bridge solutions will soon replace silicon intermediary layers as the primary choice for package HPC chips. TSMC mutengesi mukuru we2.5D silicon intermediary layers yeNVIDIA nevamwe vanotungamira HPC vanogadzira seGoogle neAmazon, uye kambani ichangobva kuzivisa kugadzirwa kwakawanda kwechizvarwa chayo chekutanga CoWoS_L ine 3.5x reticle saizi. IDTechEx inotarisira kuti maitiro aya aenderere mberi, nekumwe kufambira mberi kwakakurukurwa mumushumo wayo unobata vatambi vakuru.
2. **Panel-Level Packaging:** Panel-level packaging yave yakakosha kutarisa, sezvakaratidzwa pa2024 Taiwan International Semiconductor Exhibition. Iyi nzira yekurongedza inobvumira kushandiswa kweakakura zvidimbu zvepakati uye inobatsira kuderedza mutengo nekugadzira mamwe mapakeji panguva imwe chete. Pasinei nekukwanisa kwayo, matambudziko akadai sewarpage management achiri kuda kugadziriswa. Kuwedzera kukurumbira kwayo kunoratidza kudiwa kuri kukura kwematanho akakura, anodhura-anoshanda epakati.
3. **Glass Intermediary Layers:** Girazi riri kubuda sechinhu chakasimba chemumiriri wekuwana waya yakanaka, inofananidzwa nesilicon, ine mamwe mabhenefiti akadai seCTE inogadzirika uye kuvimbika kwepamusoro. Girazi repakati repakati rinoenderanawo nepaneru-level kurongedza, ichipa mukana wepamusoro-density wiring pamutengo unotakurika, zvichiita kuti ive mhinduro inovimbisa yeramangwana rekurongedza matekinoroji.
4. **HBM Hybrid Bonding:** 3D copper-copper (Cu-Cu) hybrid bonding ndiyo tekinoroji yakakosha yekuwana ma-ultra-fine pitch vertical interconnections pakati pemachipisi. Iyi tekinoroji yakashandiswa mumhando dzakasiyana-siyana dzepamusoro-sevha zvigadzirwa, zvinosanganisira AMD EPYC yeakaturikidzana SRAM neCPU, pamwe neMI300 yakatevedzana yekurongedza CPU/GPU zvidhinha paI/O inofa. Hybrid bonding inotarisirwa kuita basa rakakosha mukufambira mberi kweHBM mune ramangwana, kunyanya kune DRAM stacks inodarika 16-Hi kana 20-Hi layer.
5. ** Co-Packaged Optical Devices (CPO):** Nekuwedzera kuri kuda kwepamusoro data throughput uye simba rekushandisa, optical interconnect technology yakawana kutariswa kukuru. Co-packaged optical devices (CPO) iri kuita mhinduro yakakosha yekusimudzira I/O bandwidth uye kuderedza kushandiswa kwesimba. Kuenzaniswa nemagetsi echinyakare kutapurirana, kutaurirana kwemaziso kunopa zvakati wandei, zvinosanganisira yakaderera chiratidzo attenuation pamusoro madaro marefu, kuderedzwa crosstalk senitivity, uye zvakanyanya kuwedzera bandwidth. Aya mabhenefiti anoita kuti CPO ive sarudzo yakanaka kune data-yakanyanya, simba-inoshanda HPC masisitimu.
**Makiyi Misika Yekuona:**
Musika wekutanga unofambisa kusimudzira kwe2.5D uye 3D yekurongedza matekinoroji pasina mubvunzo ndiyo yepamusoro-performance computing (HPC) chikamu. Idzi nzira dzepamberi dzekurongedza dzakakosha mukukunda zvipimo zveMutemo waMoore, zvichigonesa mamwe ma transistors, ndangariro, uye kubatana mukati mepakeji imwe. Kuora kwemachipisi zvakare kunobvumira kushandiswa kwakaringana kwema process node pakati peakasiyana mabhuroki anoshanda, sekuparadzanisa maI/O mabhuroki kubva kumabhuroki ekugadzirisa, achiwedzera kusimudzira.
Pamusoro peiyo yepamusoro-performance computing (HPC), mimwe misika inotarisirwawo kukura kuburikidza nekutorwa kwehunyanzvi hwekurongedza. Muzvikamu zve5G uye 6G, hutsva hwakadai sekurongedza antenna uye yekucheka-kumucheto chip mhinduro inogadzirisa ramangwana rewireless access network (RAN) architectures. Motokari dzinozvimiririra dzichabatsirawo, sezvo matekinoroji aya achitsigira kubatanidzwa kwemasensa masutu uye computing zvikamu kuti zvigadzirise huwandu hukuru hwe data uku uchichengetedza kuchengetedzwa, kuvimbika, compactness, simba uye kudziya kwekutonga, uye mutengo-kubudirira.
Consumer electronics (kusanganisira smartphones, smartwatches, AR/VR madivayiri, PC, uye nzvimbo dzekushandira) zviri kuwedzera kutarisisa kugadzirisa data rakawanda munzvimbo diki, zvisinei nekunyanya kukoshesa mutengo. Yepamberi semiconductor packaging ichaita basa rakakosha mune iyi maitiro, kunyangwe nzira dzekurongedza dzinogona kusiyana kubva kune dzinoshandiswa muHPC.
Nguva yekutumira: Oct-25-2024