Kurongedza kweSemiconductor kwakashanduka kubva pakugadzira kwekare kwe1D PCB kusvika pakubatanidza kwe3D hybrid padanho rewafer. Kufambira mberi uku kunobvumira nzvimbo yekubatanidza pakati pema micron ari muhuwandu hwemadhigirii imwe chete, nebandwidths inosvika 1000 GB/s, ukuwo kuchichengetedza simba rakawanda. Pakati pematekinoroji epamusoro e semiconductor kurongedza kune 2.5D kurongedza (uko zvikamu zvinoiswa padivi nepadivi pane chikamu chepakati) uye kurongedza kwe3D (izvo zvinosanganisira kuisa machipisi anoshanda akamira). Matekinoroji aya akakosha kune ramangwana reHPC systems.
Tekinoroji yekurongedza ye2.5D inosanganisira zvinhu zvakasiyana-siyana zvepakati, chimwe nechimwe chine zvakanakira nezvachinokanganisa. Zvikamu zvepakati zveSilicon (Si), zvinosanganisira mawafer esilicon asingashande uye mabhiriji esilicon ari munzvimbo, anozivikanwa nekupa hunyanzvi hwepamusoro hwekubatanidza waya, zvichiita kuti zvive zvakanaka pakushandisa komputa yepamusoro. Zvisinei, zvinodhura kana tichitarisa zvinhu uye kugadzira uye zvipingamupinyi munzvimbo yekurongedza. Kuderedza matambudziko aya, kushandiswa kwemabhiriji esilicon ari munzvimbo kuri kuwedzera, zvichishandisa silicon uko kushanda kwakanaka kwakakosha kugadzirisa zvipingamupinyi zvenzvimbo.
Mapurasitiki emukati mezvinhu zvipenyu, achishandisa mapurasitiki akaumbwa nefeni, anotsiva silicon nenzira inodhura zvishoma. Ane dielectric constant yakaderera, izvo zvinoderedza kunonoka kweRC mupakeji. Pasinei nemabhenefiti aya, mapurasitiki emukati mezvinhu zvipenyu ari kutambudzika kusvika padanho rakafanana rekudzikisa maficha ekubatanidza zvinhu sepakeji yesilicon, zvichideredza kushandiswa kwawo mumapurogiramu emakombiyuta anoshanda zvakanyanya.
Magirazi anobatanidza magirazi awana kufarira kukuru, kunyanya mushure mekunge Intel yatanga kuburitsa magirazi akavakirwa pamotokari. Girazi rine mabhenefiti akati wandei, akadai se adjustable coefficient of thermal expansion (CTE), high dimensional stability, high dimensional surfaces smooth and flat, uye kugona kutsigira kugadzirwa kwemapaneru, zvichiita kuti ive mukana wekuva nemawaya anobatanidza magirazi ane wiring ability yakafanana nesilicon. Zvisinei, kunze kwezvinetso zvehunyanzvi, dambudziko guru remagirazi anobatanidza magirazi i ecosystem isina kukura uye kushaikwa kwesimba guru rekugadzira. Sezvo ecosystem ichikura uye kugona kwekugadzira kuchivandudzika, matekinoroji akavakirwa pagirazi mu semiconductor packaging anogona kuwedzera kukura nekushandiswa.
Panyaya yetekinoroji yekurongedza ye3D, Cu-Cu bump-less hybrid bonding iri kuva tekinoroji inotungamira mukuvandudza. Iyi nzira yepamusoro inowana hukama husingaperi nekubatanidza zvinhu zve dielectric (senge SiO2) nesimbi dzakaiswa mukati (Cu). Cu-Cu hybrid bonding inogona kuwana nzvimbo dziri pasi pe10 microns, kazhinji mu single-digit micron range, zvichireva kuvandudzika kukuru pane tekinoroji yechinyakare ye micro-bump, ine bump spacings inosvika 40-50 microns. Zvakanakira zve hybrid bonding zvinosanganisira kuwedzera I/O, bandwidth yakawedzerwa, 3D vertical stacking yakagadziridzwa, kushanda zvakanaka kwesimba, uye kudzikira kweparasite effects uye kupisa nekuda kwekushaikwa kwekuzadza pasi. Zvisinei, tekinoroji iyi yakaoma kugadzira uye ine mitengo yakakwira.
Matekinoroji ekurongedza e2.5D ne3D anosanganisira matekiniki akasiyana-siyana ekurongedza. Mumapakeji e2.5D, zvichienderana nesarudzo yezvinhu zvepakati, zvinogona kuiswa muzvikamu zviviri: silicon-based, organic-based, uye glass-based intermediary layers, sezvakaratidzwa mumufananidzo uri pamusoro. Mumapakeji e3D, kuvandudzwa kwetekinoroji ye micro-bump kunovavarira kuderedza miganhu yenzvimbo, asi nhasi, nekushandisa tekinoroji ye hybrid bonding (nzira yekubatanidza zvakananga Cu-Cu), miganhu yenzvimbo yenhamba imwe chete inogona kuwanikwa, zvichiratidza kufambira mberi kukuru mumunda.
**Maitiro Akakosha Etekinoroji Ekutarisa:**
1. **Nzvimbo Dzakakura Dzepakati:** IDTechEx yakambofanotaura kuti nekuda kwekuoma kwema silicon intermediary layers anodarika muganho we3x reticle size, 2.5D silicon bridge solutions ichakurumidza kutsiva silicon intermediary layers sesarudzo huru yekurongedza machipisi eHPC. TSMC ikambani huru inopa 2.5D silicon intermediary layers yeNVIDIA nevamwe vagadziri veHPC vanotungamira vakaita seGoogle neAmazon, uye kambani iyi ichangobva kuzivisa kugadzirwa kwakawanda kweCoWoS_L yechizvarwa chayo chekutanga ine 3.5x reticle size. IDTechEx inotarisira kuti maitiro aya acharamba achienderera mberi, nekufambira mberi kuri kukurukurwa mumushumo wayo unosanganisira vatambi vakuru.
2. **Kurongedza Kwepadanho Repamusoro:** Kurongedza Kwepadanho Repamusoro kwave chinhu chakakosha, sezvakaratidzwa pa2024 Taiwan International Semiconductor Exhibition. Nzira iyi yekurongedza inobvumira kushandiswa kwezvikamu zvakakura zvepakati uye inobatsira kuderedza mitengo nekugadzira mapakeji akawanda panguva imwe chete. Pasinei nekugona kwayo, matambudziko akadai sekutarisira warpage achiri kuda kugadziriswa. Kukura kwayo kuri kuwedzera kunoratidza kudiwa kuri kukura kwezvikamu zvakakura uye zvinodhura zvishoma.
3. **Magirazi Anopindirana:** Girazi riri kubuda sechinhu chakasimba chekuwana waya dzakapfava, dzakafanana nesilicon, dzine zvimwe zvakanakira zvakaita seCTE inogadziriswa uye kuvimbika kwakanyanya. Magirazi anopindirana anoenderanawo nekurongedza kwepaneru, zvichipa mukana wekubatanidza waya dzakasimba pamutengo uri nyore, zvichiita kuti ive mhinduro inovimbisa matekinoroji ekurongedza mune ramangwana.
4. **HBM Hybrid Bonding:** 3D copper-copper (Cu-Cu) hybrid bonding inyanzvi huru yekuwana ultra-fine pitch vertical interconnections pakati pemachips. Iyi tekinoroji yakashandiswa muzvigadzirwa zvakasiyana-siyana zve high-end server, kusanganisira AMD EPYC ye stacked SRAM neCPUs, pamwe neMI300 series ye stacking CPU/GPU blocks paI/O dies. Hybrid bonding inotarisirwa kutamba basa rakakosha mukuvandudzwa kweHBM mune ramangwana, kunyanya kune DRAM stacks dzinopfuura 16-Hi kana 20-Hi layers.
5. **Midziyo yeOptical Yakasanganiswa (CPO):** Nekuda kuri kukura kwekushandiswa kwedata rakawanda uye kushanda zvakanaka kwesimba, tekinoroji yekubatanidza maoptical yawana kutariswa kukuru. Midziyo yeOptical Yakasanganiswa (CPO) iri kuva mhinduro huru yekuvandudza bandwidth yeI/O uye kuderedza kushandiswa kwesimba. Zvichienzaniswa nekutapurirana kwemagetsi kwechinyakare, kutaurirana kwemaoptical kune zvakanakira zvakawanda, zvinosanganisira kudzikira kwemasaini padaro refu, kudzikira kwekunzwa kwecrosstalk, uye kuwedzera bandwidth zvakanyanya. Zvakanakira izvi zvinoita kuti CPO ive sarudzo yakakodzera kune masisitimu eHPC anoshandisa data zvakanyanya uye asingashandise simba zvakanyanya.
**Misika Yakakosha Yekutarisa:**
Musika mukuru unotungamira kukura kwetekinoroji ye2.5D ne3D yekurongedza pasina mubvunzo ichikamu che high-performance computing (HPC). Idzi nzira dzepamusoro dzekurongedza dzakakosha pakukunda zvipingamupinyi zveMoore's Law, zvichiita kuti ma transistors akawanda, memory, uye connections zvive mukati mepakeji imwe chete. Kuora kwemachipisi kunobvumirawo kushandiswa kwakanakisa kwema process nodes pakati pema functional blocks akasiyana, sekuparadzanisa ma I/O blocks kubva kuma processing blocks, zvichiwedzera kushanda zvakanaka.
Pamusoro pekushandisa komputa yepamusoro (HPC), mimwe misika inotarisirwawo kukura kuburikidza nekushandisa matekinoroji epamusoro ekurongedza. Muzvikamu zve5G ne6G, hunyanzvi hwakadai sema antenna ekurongedza uye mhinduro dzechip dzemazuva ano dzichaumba ramangwana remagadzirirwo enetwork ye wireless access (RAN). Mota dzinozvitonga dzichabatsirwawo, sezvo matekinoroji aya achitsigira kubatanidzwa kwema sensor suites nemayuniti ekombuta kuti agadzirise data rakawanda uku achivimbisa kuchengetedzeka, kuvimbika, kusimba, simba uye kutonga kwekupisa, uye kushanda zvakanaka kwemari.
Zvishandiso zvemagetsi zvevatengi (kusanganisira mafoni, mawachi, zvishandiso zveAR/VR, maPC, uye nzvimbo dzekushandira) zviri kuramba zvichinyanya kutarisa pakugadzirisa data rakawanda munzvimbo diki, pasinei nekunyanya kukoshesa mutengo. Kurongedza kwe semiconductor yepamusoro kuchaita basa guru mukuita uku, kunyangwe nzira dzekurongedza dzingasiyana nedzinoshandiswa muHPC.
Nguva yekutumira: Gumiguru-07-2024