San Jose - Samsung Electronics Co ichavhura matatu-Dimensional (3D) Tekinoroji yeChipfumi (HBM) Mukati mechikamu chechitanhatu Chip.
Musi waJune 20, mupendero mukuru wepasirese wepasirese
Yaive yekutanga nguva samsung kusunungura iyo 3D mapepa ekutonga kweHBM Chips mune chiitiko cheveruzhinji. Parizvino, HBM Chips yakarongedzwa zvakanyanya ne2,5D tekinoroji.
Izvo zvakauya anenge mavhiki maviri mushure mekunge Nvidia Co-mukuru uye mukuru wejenen Huang akaunganidza iyo itsva-yechizvarwa chivakwa cheAI chikuva yechikuva chiPuratiform rubin panguva yekutaura muTaiwan.
HBM4 ingangove yakanyorwa muNvidia idzva Rubin GPU muenzaniso inotarisirwa kurova musika muna 2026.
Vertical kubatana
Samsung
Parizvino, HBM PIPS yakabatana neGPU pane silicon yekubatanidza pasi pe2,5d pacomputer tekinoroji.
Kana tichienzanisa, 3D kurongedza hakudi silicon inodhinda, kana iyo yakaonda substrate iyo inogara pakati pezviputi kuti vabvumire kutaurirana uye kushanda pamwe. Samsung Dubs its nyowani mapaketi epaclication seSaint-D, pfupi yeSamsung Advanced Interconnection Technology-D.
Turnkey Service
Iyo South Korea Kambani inonzwisiswa yekupa 3D HBM Pairating paNychechi.
Kuti uite kudaro, timu yayo yepamusoro yekukwira ichavhara muHBm Chips
"3D kurongedza kunodzora simba rekushandisa simba uye kunonoka kurira, kuvandudza mhando yemasaini yemagetsi e semiconondductor machira," akadaro emagetsi emagetsi emagetsi. Muna 2027, zvirongwa zveSamsung zvekusvitsa zvese-mu-imwe heterojentious yekubatanidza zvinhu zvinobatanidza zvinoshamisa zvinowedzera zvinoshamisa zvekusimudzira kwemifananidzo yemiesvedzero yemakiromita mune imwe pasuru yeAi accelorators.
Mukuwirirana nekukura kwekuwedzera kwesimba-simba, high-perform-performance
MGI ROKUFUNGEDZESESESESESESESESESESESESESESI PAKUTSIRE PEKIKI REMAHARA, kusanganisira 3D kurongedza, kukura kumadhora mazana masere nemakumi mairi nemakumi mairi nemakumi mairi nemakumi mairi nemazana matatu emadhora emadhora muna 2023.
Kutumira Nguva: Jun-10-2024