SAN JOSE -- Samsung Electronics Co. ichavhura matatu-dimensional (3D) ekurongedza masevhisi epamusoro-bandwidth memory (HBM) mukati megore, tekinoroji inotarisirwa kuunzwa yeyakagadzirwa intelligence chip's yechitanhatu-chizvarwa modhi HBM4 nekuda kwe2025, maererano nekambani uye indasitiri masosi.
Musi waChikumi 20, mukuru wepasirese memory chipmaker akafumura tekinoroji yayo yazvino chip yekurongedza uye masevhisi emigwagwa paSamsung Foundry Forum 2024 yakaitirwa muSan Jose, California.
Yakanga iri nguva yekutanga Samsung kuburitsa iyo 3D yekurongedza tekinoroji yeHBM machipi mune yeruzhinji chiitiko.Parizvino, machipisi eHBM akaiswa zvakanyanya neiyo 2.5D tekinoroji.
Zvakauya anenge mavhiki maviri mushure mekunge Nvidia co-muvambi uye Chief Executive Jensen Huang akafumura iyo nyowani-chizvarwa chivakwa cheiyo AI chikuva Rubin panguva yekutaura muTaiwan.
HBM4 ingangove yakamisikidzwa muNvidia nyowani Rubin GPU modhi inotarisirwa kurova musika muna 2026.
VERTICAL CONNECTION
Samsung yemazuva ano yekurongedza tekinoroji inoratidzira HBM machipi akaturikidzana pamusoro peGPU kuti ienderere mberi nekumhanyisa kudzidza kwedata uye inference processing, tekinoroji inoonekwa sekuchinja kwemutambo mumusika uri kukura weAI chip.
Parizvino, machipisi eHBM akabatana neGPU pane silicon interposer pasi peiyo 2.5D yekurongedza tekinoroji.
Kana tichienzanisa, 3D kurongedza haidi silicon interposer, kana substrate yakatetepa inogara pakati pemachipisi kuvabvumira kutaurirana uye kushanda pamwechete.Samsung inodaidzira tekinoroji yayo nyowani yekurongedza seSAINT-D, pfupi yeSamsung Advanced Interconnection Technology-D.
TURNKEY SERVICE
Iyo kambani yeSouth Korea inonzwisiswa kupa 3D HBM kurongedza pane turnkey hwaro.
Kuti iite kudaro, timu yayo yepamberi yekurongedza inozobatanidza HBM machipi anogadzirwa pachikamu chayo chebhizinesi rekurangarira nemaGPU akaunganidzirwa makambani asina fable neayo ekutanga unit.
"3D packaging inoderedza kushandiswa kwemagetsi uye kunonoka kugadzirisa, kuvandudza mhando yemagetsi masaini esemiconductor machipisi," akadaro mumwe mukuru weSamsung Electronics.Muna 2027, Samsung inoronga kuunza zvese-mu-imwe heterogeneous yekubatanidza tekinoroji iyo inosanganisa zvinhu zvemaziso izvo zvinowedzera zvakanyanya kumhanyisa data kwema semiconductors mune imwe yakabatana pasuru yeAI accelerators.
Zvinoenderana nekukura kuri kuda kwesimba rakaderera, machipisi epamusoro-soro, HBM inofungidzirwa kuti ichaita makumi matatu muzana emusika weDRAM muna 2025 kubva pa21% muna 2024, maererano neTrendForce, kambani yekuTaiwanese yekutsvagisa.
MGI Tsvagiridzo inofungidzira musika wepamberi wekurongedza, unosanganisira 3D kurongedza, kukura kusvika pamadhora makumi masere emabhiriyoni panosvika 2032, zvichienzaniswa nemadhora mazana matatu nemakumi matatu emadhora muna 2023.
Nguva yekutumira: Jun-10-2024