SAN JOSE -- Samsung Electronics Co. ichatanga mabasa ekurongedza zvinhu zvine mativi matatu (3D) ekuchengetedza ndangariro yepamusoro (HBM) mukati megore, tekinoroji inotarisirwa kuunzwa yemhando yechitanhatu yeHBM4 chip yerudzi rwechitanhatu ichaitwa muna 2025, sekureva kwekambani nemakambani ari muindasitiri.
Musi wa20 Chikumi, kambani huru yepasi rose inogadzira chips dzekurangarira yakaburitsa tekinoroji yayo yemazuva ano yekurongedza chips uye magadzirirwo ebasa pamusangano weSamsung Foundry Forum 2024 wakaitirwa muSan Jose, California.
Yaiva nguva yekutanga Samsung kuburitsa tekinoroji yekurongedza ye3D yemachipisi eHBM pamusangano weveruzhinji. Parizvino, machipisi eHBM anonyanya kuputirwa netekinoroji ye2.5D.
Izvi zvakaitika mavhiki maviri mushure mekunge mumwe wevakatanga Nvidia uye Mukuru wekambani Jensen Huang aburitsa pachena dhizaini yerudzi rutsva rwepuratifomu yayo yeAI Rubin panguva yekutaura kuTaiwan.
HBM4 ingangove iri mumhando itsva yeNvidia yeRubin GPU inotarisirwa kutanga kushanda muna 2026.
KUBATANIDZA KWAKATOTA
Tekinoroji yazvino yeSamsung yekurongedza ine machipisi eHBM akaiswa pamusoro peGPU kuti akurumidze kudzidza data uye kugadzirisa fungidziro, tekinoroji inoonekwa seyakachinja mutambo mumusika wemachipisi eAI uri kukura nekukurumidza.
Parizvino, machipisi eHBM akabatana neGPU iri pa silicon interposer pasi pe tekinoroji yekurongedza ye2.5D.
Kana tichienzanisa, kurongedza kwe3D hakudi silicon interposer, kana substrate yakatetepa iri pakati pemachipisi kuti akwanise kutaurirana nekushanda pamwe chete. Samsung inotumidza tekinoroji yayo itsva yekurongedza kuti SAINT-D, muchidimbu Samsung Advanced Interconnection Technology-D.
BASA REKUSHANDISA ZVINHU
Kambani yekuSouth Korea inozivikanwa nekupa mapurasitiki e3D HBM zvichienderana nezvinodiwa.
Kuti zvidaro, timu yavo yepamusoro yekurongedza ichabatanidza machipisi eHBM anogadzirwa muchikamu chebhizinesi rayo rekurangarira nemaGPU akaunganidzirwa makambani asina hunyanzvi nechikamu chayo chekugadzira zvinhu.
"Kurongedza kwe3D kunoderedza kushandiswa kwesimba uye kunonoka kwekugadzirisa, zvichivandudza mhando yemasaini emagetsi emachipisi e semiconductor," akadaro mumwe mukuru weSamsung Electronics. Muna 2027, Samsung inoronga kuunza tekinoroji yekubatanidza yese-in-one ine zvinhu zve optical zvinowedzera zvakanyanya kumhanya kwekutumira data kwema semiconductors mupakeji imwe chete yeAI accelerators.
Zvichienderana nekukura kuri kuita kudiwa kwemachipisi ane simba shoma uye anoshanda zvakanyanya, HBM inofungidzirwa kuti ichaita 30% yemusika weDRAM muna 2025 kubva pa21% muna 2024, sekureva kweTrendForce, kambani yekutsvagisa yeTaiwan.
MGI Research inofanotaura kuti musika wekurongedza wepamusoro, kusanganisira kurongedza kwe3D, uchakura kusvika mabhiriyoni makumi masere emadhora panosvika 2032, zvichienzaniswa nemadhora mabhiriyoni makumi matatu nemana nehafu muna 2023.
Nguva yekutumira: Chikumi-10-2024